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 MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Quad 2-Input AND Gate with LSTTL-Compatible Inputs
High-Performance Silicon-Gate CMOS
The MC54/74HCT08A may be used as a level converter for interfacing TTL or NMOS outputs to high-speed CMOS inputs. The HCT08A is identical in pinout to the LS08. * * * * * * Output Drive Capability: 10 LSTTL Loads TTL/NMOS-Compatible Input Levels Outputs Directly Interface to CMOS, NMOS and TTL Operating Voltage Range: 4.5 to 5.5 V Low Input Current: 1.0 A In Compliance with the Requirements Defined by JEDEC Standard No. 7A * Chip Complexity: 40 FETs or 10 Equivalent Gates
MC54/74HCT08A
J SUFFIX CERAMIC PACKAGE CASE 632-08
1
14
14 1
N SUFFIX PLASTIC PACKAGE CASE 646-06
14 1
D SUFFIX SOIC PACKAGE CASE 751A-03
ORDERING INFORMATION
LOGIC DIAGRAM
A1 B1 A2 B2 A3 B3 A4 B4 1 3 2 4 6 5 9 8 10 12 11 13 PIN 14 = VCC PIN 7 = GND Y4 Y3 Y2 Y1
MC54HCTXXAJ MC74HCTXXAN MC74HCTXXAD
Ceramic Plastic SOIC
PIN ASSIGNMENT
A1 Y = AB B1 Y1 A2 B2 Y2 GND 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VCC B4 A4 Y4 B3 A3 Y3
FUNCTION TABLE
Inputs A L L H H B L H L H Output Y L L L H
10/95
(c) Motorola, Inc. 1995
1
REV 6
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I I I III I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I III II I I I I I I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I III II I I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I I I I III II I I I I I I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I III I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I III I I I IIIIIIIIIIIIIIIII II I II II I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIII IIIIIIIIIIIIII II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII II I I III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I III IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I
* Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C Ceramic DIP: - 10 mW/_C from 100_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I III I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I III I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I IIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII III IIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII
MAXIMUM RATINGS*
MOTOROLA
RECOMMENDED OPERATING CONDITIONS
DC CHARACTERISTICS FOR THE MC54/74HCT08A (Voltages Referenced to GND)
MC54/74HCT08A
Symbol
Symbol
Vin, Vout
Symbol
VCC
ICC
Vout
VOH
Tstg
VOL
ICC
Iout
VCC
ICC
VIH
Vin
PD
VIL
TL
tr, tf
Iin
Iin
TA
Lead Temperature, 1 mm from case for 10 Seconds (SOIC or Plastic DIP) (Ceramic DIP)
Storage Temperature
Power Dissipation in Still Air, Plastic or Ceramic DIP SOIC Package
DC Supply Current, VCC and GND Pins
DC Output Current, per Pin
DC Input Current, per Pin
DC Output Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Additional Quiescent Supply Current
Maximum Quiescent Supply Current (per Package)
Maximum Input Leakage Current
Maximum Low-Level Output Voltage
Minimum High-Level Output Voltage
Maximum Low-Level Input Voltage
Minimum High-Level Input Voltage
Input Rise and Fall Time (Figure 1)
Operating Temperature, All Package Types
DC Input Voltage, Output Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Parameter
Parameter
Parameter
Vin = 2.4 V, Any One Input Vin = VCC or GND, Other Inputs lout = 0 mA
Vin = VIH or VIL |Iout| 4.0 mA
Vin = VIH or VIL |Iout| 20 A
Vin = VIH or VIL |Iout| 4.0 mA
Vin = VIH or VIL |Iout| 20 A
Vin = VCC or GND |Iout| = 0 A
Vin = VCC or GND
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
v
v
v
v
v
v
Test Conditions
- 0.5 to VCC + 0.5
- 1.5 to VCC + 1.5
- 65 to + 150
- 0.5 to + 7.0
2 - 55 Min 4.5 Value 0 0 50 25 20 VCC Volts 260 300 750 500 5.5 5.5 5.5 4.5 4.5 5.5 4.5 4.5 5.5 4.5 5.5 4.5 5.5 + 125 VCC Max 500 5.5 3.98 4.40 5.40 2.00 2.00 Min - 55 to 25_C Unit Unit mW mA mA mA
_C
_C _C
_C
ns
V
V
V
V
V
0.10
0.26
0.10 0.10
0.80 0.80
Max
1
- 55_C
2.9
Guaranteed Limit
3.84
4.40 5.40
2.00 2.00
Min
v 85_C
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
1.00
25_ to 125_C
0.33
0.10 0.10
0.80 0.80
Max
10
High-Speed CMOS Logic Data DL129 -- Rev 6 2.4
v
3.70
4.40 5.40
2.00 2.00
Min
v 125_C
1.00
0.40
0.10 0.10
0.80 0.80
Max
40
v
Unit
mA A A V V V V
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I I III I I II I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I I III I I II I I I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I III I II II II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High- Speed CMOS Data Book (DL129/D).
High-Speed CMOS Logic Data DL129 -- Rev 6 OUTPUT Y Symbol INPUT A OR B tPLH, tPHL tTLH, tTHL CPD Cin tPLH Power Dissipation Capacitance (Per Gate)* Maximum Input Capacitance Maximum Output Transition Time, Any Output Maximum Propagation Delay, Input A or B to Output Y tTLH
* Used to determine the no-load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
AC CHARACTERISTICS FOR THE MC54/74HCT08A (VCC = 5.0 V 10%, CL = 50 pF, Input tr = tf = 6 ns)
Figure 1. Switching Waveforms
1.3 V 10%
10%
90% 1.3 V
90%
tr
tf
Parameter
A
B
EXPANDED LOGIC DIAGRAM (1/4 OF THE DEVICE)
tPHL
tTHL
GND
3.0 V
3 Fig. 1, 2 1, 2 -- Min - 55 to 25_C Max Typical @ 25C, VCC = 5.0 V 10 15 19 Y Guaranteed Limit Min
* Includes all probe and jig capacitance
v 85_C
Figure 2. Test Circuit
DEVICE UNDER TEST
20
Max
10
19
24
MC54/74HCT08A
OUTPUT
Min
v 125_C
TEST POINT
Max
10
22
28
MOTOROLA CL* Unit pF ns ns pF
MC54/74HCT08A
OUTLINE DIMENSIONS
J SUFFIX CERAMIC DIP PACKAGE CASE 632-08 ISSUE Y
8
-A14
-B1 7
C
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMESNION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. INCHES MIN MAX 0.750 0.785 0.245 0.280 0.155 0.200 0.015 0.020 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0 15 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.94 6.23 7.11 3.94 5.08 0.39 0.50 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0 15 0.51 1.01
-TSEATING PLANE
K F G D 14 PL 0.25 (0.010) N
M
M
S
TA
J 14 PL 0.25 (0.010)
M
T
B
S
DIM A B C D F G J K L M N
N SUFFIX PLASTIC DIP PACKAGE CASE 646-06 ISSUE L
14 8
B
1 7
NOTES: 1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 4. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M N INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.300 BSC 0_ 10_ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.62 BSC 0_ 10_ 0.39 1.01
A F C N H G D
SEATING PLANE
L
J K M
-A-
14 8
D SUFFIX PLASTIC SOIC PACKAGE CASE 751A-03 ISSUE F
-B-
1 7
P 7 PL
0.25 (0.010)
M
B
M
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
G C
R X 45
F
SEATING PLANE
D
14 PL
K
M
M B
S
J
0.25 (0.010)
T
A
S
DIM A B C D F G J K M P R
MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 6.20 5.80 0.50 0.25
INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.228 0.244 0.010 0.019
MOTOROLA
4
High-Speed CMOS Logic Data DL129 -- Rev 6
MC54/74HCT08A
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
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JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, Toshikatsu Otsuki, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-3521-8315 HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
High-Speed CMOS Logic Data DL129 -- Rev 6
CODELINE
5
*MC54/74HCT08A/D*
MC54/74HCT08A/D MOTOROLA


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